Picture: Danish Technological Institute
The rising energy demand of data centers is increasingly bringing new cooling concepts into focus. In the European research project AM2PC, the Danish Technological Institute and the company Heatflow developed a 3D-printed cooling component that noticeably reduces the energy required for heat dissipation. At the same time, the approach opens up perspectives for the use of waste heat, for example in district heating networks.
At its core, the solution is based on a passive two-phase cooling system that operates without pumps or fans. Instead, a cooling medium evaporates directly at the hot surface of processors or accelerators, rises due to density differences, condenses at a cooler location, and then flows back under the influence of gravity. This thermosiphon principle enables particularly efficient heat transfer. In tests, the prototype achieved a cooling capacity of 600 watts, significantly exceeding the original target values.
Additive manufacturing plays a central role in this approach. The evaporator was produced from aluminum using 3D printing and combines several functions in a single component.
“Besides the actual IT hardware, the corresponding cooling infrastructure is one of the major energy consumers in a data center – and therefore the greatest potential to improve overall system efficiency,” explains Simon Brudler, 3D-printing specialist and senior consultant at Danish Technological Institute.
Additive manufacturing also enables internal geometries that would be difficult to realize with conventional processes and are crucial for heat transport.
The approach addresses a growing problem: modern GPUs and servers are reaching power densities at which conventional air cooling hits physical limits.
“We are seeing a development where the power density in servers is increasing faster than ever before, and traditional air cooling is simply no longer sufficient. With our two-phase solution, we can remove heat passively without pumps or fans, which significantly reduces the energy consumption for cooling,” says Paw Mortensen, CEO of Heatflow, who led the AM2PC project.“By 3D printing the component in aluminium, we can integrate all necessary functions into a single part. This eliminates assembly points, reduces the risk of leaks, and makes the component more reliable. At the same time, we use only one material, which makes it easier to recycle,” explains Simon Brudler.
Also noteworthy is the temperature level of the dissipated heat. At 60 to 80 degrees Celsius, it is in principle suitable for direct feeding into district heating networks or for industrial processes. Although this integration was not the main focus of the project, the results show that 3D-printed cooling technology can contribute to more efficient and better-integrated data centers.
“In the project, we did not focus on the integration with district heating itself, but we have demonstrated that the technology enables it. This is an important step toward more energy-efficient data centers that can contribute positively to the overall energy balance,” emphasizes Simon Brudler.
Subscribe to our Newsletter
3DPresso is a weekly newsletter that links to the most exciting global stories from the 3D printing and additive manufacturing industry.
