Applied Materials, Inc.
Digital Lithography Technology (DLT)
New digital lithography technology from Applied Materials and Ushio to accelerate the computer industry’s transition to heterogeneous chiplet integration on glass and other large package substrates.
Digital Lithography Technology (DLT)
Applied Materials and Ushio are introducing a breakthrough digital lithography system for glass and other large package substrates that enables high-performance heterogeneous chip designs for the AI era of computing.
- Strategic partnership to accelerate industry’s transition to heterogeneous chiplet integration on glass and other large substrates
- Partnership combines Applied’s leadership in large panel processing with Ushio’s leadership in lithography for packaging
- New digital lithography technology to enable world’s leading chipmakers to combine chips with sub-micron wiring
SANTA CLARA, Calif. and TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and Ushio, Inc. today announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous integration (HI) of chiplets into 3D packages. The companies are jointly bringing to market the first digital lithography system specifically designed for patterning the advanced substrates needed in the Artificial Intelligence (AI) era of computing.
Rapidly growing AI workloads are driving the need for larger chips with greater functionality. As the performance requirements of AI outpaces traditional Moore’s Law scaling, chipmakers are increasingly adopting HI techniques that combine multiple chiplets in an advanced package to deliver similar or higher performance and bandwidth as a monolithic chip. The industry needs larger package substrates based on new materials such as glass that enable extremely fine-pitch interconnects and superior electrical and mechanical properties. The strategic partnership between Applied and Ushio brings together two industry leaders to accelerate this transition.
“Applied’s new Digital Lithography Technology (DLT) is the first patterning system that directly addresses the needs of our customers’ advanced substrate roadmaps,” said Dr. Sundar Ramamurthy, Group Vice President and General Manager of HI, ICAPS and Epitaxy, Semiconductor Products Group at Applied Materials. “We are leveraging our unmatched expertise in large substrate processing, the industry’s broadest portfolio of HI technologies, and deep R&D resources to enable a new generation of innovation in high-performance computing.”
